VIA Technologies, has announced the release of a Linux BSP based on Yocto 2.0.3 for the VIA SOM-9X20 Module. It will enable rapid development of next-generation Edge AI systems and devices
The VIA SOM-9X20 is a highly-integrated system-on-module powered by the Qualcomm Snapdragon 820E embedded platform. It measures 8.2cm x 4.5cm, only. The module features 64GB eMMC flash memory and 4GB LPDDR4 SDRAM onboard.
“The release of the Linux BSP gives our customers an additional option for the development of Edge AI systems and devices powered by the Qualcomm Snapdragon 820E Embedded Platform,” said Richard Brown, Vice-President of International Marketing, VIA Technologies, Inc. “VIA also provides a full set of system hardware and software customization services that boost time to market and minimize development costs.”
VIA SOM-9X20 offers rich I/O and display expansion options through its MXM 3.0 314-pin connector, including USB 3.0, USB 2.0, HDMI 2.0, SDIO, PCIe, MIPI CSI, MIPI DSI, and multi-function pins for UART, I2C, SPI, and GPIO.
Some of the USP of the BSP includes, it supporting UFS boot and HDMI display. It also supports AUO MIPI capacitive touch panels through USB interface. It supports built-in Wi-Fi 802.11 a/b/g/n/ac, Bluetooth 4.1, and GPS. A choice of BSPs based on Android 8.0 or Yocto 2.0.3 is available.